2023 IEEE International Conference on Electronic Information and Communication Technology (ICEICT 2023) will be held in Qingdao, China on July 21-24, 2023.

ICEICT 2023 is sponsored by Qingdao University and IEEE Harbin Section. It is also supported by IEEE Harbin AP/MTT/EMC Joint Chapter, Shandong University, Ocean University of China, China University of Petroleum (East China), Qingdao University of Technology, Qingdao University of Science and Technology, Shandong University of Science and Technology, Ceyear Technologies Co. Ltd, Qingdao Z-Chip Technologies Co. Ltd, IEEE Qingdao AP/MTT/COM Joint Chapter.

It is the sixth forum to provide a platform for bringing together researchers, practitioners, and academia to present and discuss ideas, challenges and potential solutions on established or emerging topics related to research and practice in antennas, information technology and communication systems.

The ICEICT conferences have been successfully held for five times since 2016. They were held by Harbin Institute of Technology in Harbin in 2016, Harbin Engineering University in Harbin in 2019, Shenzhen University in November in 2020, Xi'an Jiaotong University in August in 2021 and Anhui University in August in 2022, respectively. All accepted papers of the ICEICT have been indexed by EI Compendex and published in IEEE Xplore, respectively.

The proceedings of ICEICT 2023 that meet IEEE quality review standards will be eligible for inclusion in the IEEE Xplore Digital after the review taken by IEEE conference publication group and then submitted to EI Compendex index.

Excellent papers selected from IEEE ICEICT 2023 will be recommended to be published on suitable SCI journals:
1. Sensors (SCI: ISSN: 1424-8220; IF: 3.847)
2. Materials (SCI: ISSN: 1996-1944; IF: 3.748)
3. Nanotechnology (SCI: ISSN: 0957-4484; IF: 3.953)
4. Frontiers in Chemistry (SCI: ISSN: 2296-2646; IF: 5.545)

ICEICT2023 has been listed in IEEE Publication Recommender[CLICK]

IEEE Part Number: CFP23F64-USB © ISBN: 979-8-3503-9904-2


Qingdao University

IEEE Harbin Section